To innovate, we focus on pushing the limits of what's possible, both with materials and during the manufacturing process.
Dave is passionate about innovation in data connectivity. Throughout his nearly 30-year career as a system-design engineer, he has partnered with customers to design high-speed communications systems for increased efficiency and business growth. As a TE Connectivity (TE) Fellow and the leader of the global System Architecture and Signal Integrity group, Dave provides the technical direction to help his team gain the technical competency needed to compete in our markets. Holding over 30 granted patents and the author of numerous technical articles, Dave is also responsible for developing technology drivers – such as standards, silicon technology, and data center design – for product innovation at TE.
Which connectivity challenges are you working to solve?
The data communications industry is hungry for high-speed data transfer at ever-increasing densities. This requires transitioning from signal speeds of 28 and 56 Gbps to data rates of 112 Gbps. The challenge that our customers face is designing cost-effective products which are capable of handling 112 Gbps. At TE, we are focused on adapting our portfolio of data connectivity products to perform at 112 Gbps. To innovate, we focus on pushing the limits of what's possible, both with materials and during the manufacturing process.
What are the challenges in manufacturing products operating at data center speeds?
There are many. One of the most significant is resolving the manufacturing tolerances involved in designing connectivity products that offer the capacity to address 112 Gbps requirements. Ignoring this means that a part which meets specification in a nominal condition can easily fail under normal manufacturing tolerances. For example, contact position variations of 0.05mm can make the difference between passing and failing electrical performance. These sensitivities push the limits of manufacturing capability.
We work to achieve a robust design that can meet specification across a broad tolerance range without increasing cost. While some sensitivities are unavoidable, these must be identified early so that risks can be mitigated before tools are built. Success requires a comprehensive development process that factors in real manufacturing tolerances from the production plant.
Which market forces are impacting the evolution of data connectivity?
The primary driver is the transition to the cloud. This is because the hyperscale cloud providers must drive technology at a very fast pace. These types of companies may need to process data at a massive scale. They operate hundreds of data centers, and each can be as large as a football field. In this environment, reliable, high-speed performance can be critical to business stability. These companies may rely on and expect the highest performance possible to support accelerated technology growth.
What things is your team doing to enable innovation?
We have a rigorous technology roadmap. Early on, we start by identifying technology trends driving our customer markets. From these trends, we look for gaps and how our products can help customers solve for these opportunities, such as 5G and artificial intelligence (AI). Then, we focus on developing products for these technologies. These advanced development projects enable us to develop solutions before the market demands them. This process gives us the time and focus we need to drive innovation.
The types of projects can shift an industry. We achieved this when we developed the building block for new server/storage architectures. This kind of innovation can touch everyone that connects to the cloud. It is gratifying to see some of our ideas become solutions that improve how the world communicates.
To innovate, we focus on pushing the limits of what's possible, both with materials and during the manufacturing process.
Dave is passionate about innovation in data connectivity. Throughout his nearly 30-year career as a system-design engineer, he has partnered with customers to design high-speed communications systems for increased efficiency and business growth. As a TE Connectivity (TE) Fellow and the leader of the global System Architecture and Signal Integrity group, Dave provides the technical direction to help his team gain the technical competency needed to compete in our markets. Holding over 30 granted patents and the author of numerous technical articles, Dave is also responsible for developing technology drivers – such as standards, silicon technology, and data center design – for product innovation at TE.
Which connectivity challenges are you working to solve?
The data communications industry is hungry for high-speed data transfer at ever-increasing densities. This requires transitioning from signal speeds of 28 and 56 Gbps to data rates of 112 Gbps. The challenge that our customers face is designing cost-effective products which are capable of handling 112 Gbps. At TE, we are focused on adapting our portfolio of data connectivity products to perform at 112 Gbps. To innovate, we focus on pushing the limits of what's possible, both with materials and during the manufacturing process.
What are the challenges in manufacturing products operating at data center speeds?
There are many. One of the most significant is resolving the manufacturing tolerances involved in designing connectivity products that offer the capacity to address 112 Gbps requirements. Ignoring this means that a part which meets specification in a nominal condition can easily fail under normal manufacturing tolerances. For example, contact position variations of 0.05mm can make the difference between passing and failing electrical performance. These sensitivities push the limits of manufacturing capability.
We work to achieve a robust design that can meet specification across a broad tolerance range without increasing cost. While some sensitivities are unavoidable, these must be identified early so that risks can be mitigated before tools are built. Success requires a comprehensive development process that factors in real manufacturing tolerances from the production plant.
Which market forces are impacting the evolution of data connectivity?
The primary driver is the transition to the cloud. This is because the hyperscale cloud providers must drive technology at a very fast pace. These types of companies may need to process data at a massive scale. They operate hundreds of data centers, and each can be as large as a football field. In this environment, reliable, high-speed performance can be critical to business stability. These companies may rely on and expect the highest performance possible to support accelerated technology growth.
What things is your team doing to enable innovation?
We have a rigorous technology roadmap. Early on, we start by identifying technology trends driving our customer markets. From these trends, we look for gaps and how our products can help customers solve for these opportunities, such as 5G and artificial intelligence (AI). Then, we focus on developing products for these technologies. These advanced development projects enable us to develop solutions before the market demands them. This process gives us the time and focus we need to drive innovation.
The types of projects can shift an industry. We achieved this when we developed the building block for new server/storage architectures. This kind of innovation can touch everyone that connects to the cloud. It is gratifying to see some of our ideas become solutions that improve how the world communicates.
