Designed Today for Future Speeds: zQSFP+ Interconnects (English)

Design Today for Future Speeds

Narrator: As data usage continues to rise, designers need interconnect solutions that can provide increased data rates while maintaining a consistent level of reliable performanc

zQSFP+ Interconnects
Faster Connections for Data Transfer

Narrator: TE Connectivity’s comprehensive zQSFP+ interconnect portfolio helps to meet this need by offering 2.5 times more throughput than existing interconnect solutions while offering backwards compatibility with QSFP/QSFP+ products. These features provide a flexible upgrade path to increase data rates from 10 Giga-bits per second to 25 Giga-bits per second.

zQSFP+ Interconnects

• Faster Connections for Data Transfer
• Four channels of 25 Gb/s data rates
• Supports 100 Gb/s Ethernet and InfiniBand EDR requirements

Narrator: Providing four channels with data rates of 25 Gigabytes per second, the zQSFP+ interconnect supports 100 Giga-bit per second Ethernet and 100 Giga-bit per second InfiniBand Enhanced Data Rate requirements for high speed designs.

Lucas Benson, Product Manager, TE Connectivity

Benson: TE’s zQSFP+ Interconnects help optical module and cable assembly speeds reach new levels, increasing data transfer rates by 2.5 times over existing solutions.

zQSFP+ Interconnects

• Faster Connections for Data Transfer
• zQSFP+ interconnect provides excellent EMI protection through 25 Gb/s

Benson: And since increased data rates can make EMI protection more challenging, the zQSFP+ interconnect product portfolio is designed to enable improved EMI protection through 25 gigabytes per second.

zQSFP+ Interconnects

• Faster Connections for Data Transfer
• Single row cages are belly-to-belly compatible
• Able to separate ports for better thermal transfer

Benson: Design flexibility for thermal management is crucial for our customers. As such, our single row cages have been designed to be belly to belly compatible so that in higher load applications customers can separate ports for improved thermal transfer.

Lucas Benson, Product Manager, TE Connectivity

Benson: With a comprehensive portfolio including behind and thru bezel cages with various lightpipe and heat sink options, designers achieve ultimate design flexibility in function and performance.

Product Features
Comprehensive interconnect portfolio providing customers with one of widest product selections in market

Benson: In response to the significant market demand for technology in data center applications, TE offers a comprehensive zQSFP+ interconnect product portfolio providing our customers with one of the widest product selections in the market.

zQSFP+ Interconnects

• Enabling Communication in Harsh Environments
• Increased Data Rates
• Improved EMI Performance
• Comprehensive Product Portfolio

Narrator: Enable faster speeds in today’s designs with TE’s comprehensive zQSFP+ interconnect portfolio, providing a scalable interface to easily move from 10 Giga-bits per second to 25 Giga-bit per second data rates.

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• Increased Data Rates.
• Improved EMI Performance.
• Comprehensive Product Portfolio.
• zQSFP+ interconnects from TE Connectivity.

Contact your TE representative or distributor today.

Narrator:
Want to learn more? Contact your TE representative or distributor today!

TE Connectivity, TE, TE connectivity (logo), and EVERY CONNECTION COUNTS are trademarks of the TE Connectivity Ltd. Family of companies. zQSFP+ is a part of the ZXP® family of connectors and uses ZXP technology. ZXP is a trademark of Molex, LLC.

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TE Connectivity

Every Connection Counts