Product List for Discrete Sockets

184 Matching Products

50 of the 184 matching products are listed below.
Return to the Product Feature Selector to refine this list.

Common Features
Beryllium Copper Contact Base Material	AMP

Select First 20 Parts	Part	Differing Features
	50462-6 Active Add to Part List	Government/Industry Qualification = No RoHS compliant ELV compliant Lead Free Solder Processes = Wave solder capable to 240°C Lead Free Solder Processes = Wave solder capable to 260°C Lead Free Solder Processes = Wave solder capable to 265°C Lead Free Solder Processes = Reflow solder capable to 245°C Lead Free Solder Processes = Reflow solder capable to 260°C Lead Free Solder Processes = Pin-in-Paste capable to 245°C Lead Free Solder Processes = Pin-in-Paste capable to 260°C Mating Pin Dia. Range = .36 - .66 mm Socket Length = 4.52 mm Sleeve Style = Closed Bottom Gold Flash over Nickel Sleeve Plating Material Gold (30) Contact Spring Plating Production Application Without Sealant Insertion Method = Hand/Semi-Automatic Packaging Method = Loose Piece Always was RoHS compliant Copper Sleeve Material Beryllium Copper Spring Material Recommended Hole Size = 1.32 mm
View Product Details for 50462-6
	50863-4 Active Add to Part List	Government/Industry Qualification = No RoHS compliant ELV compliant Lead Free Solder Processes = Wave solder capable to 240°C Lead Free Solder Processes = Wave solder capable to 260°C Lead Free Solder Processes = Wave solder capable to 265°C Lead Free Solder Processes = Reflow solder capable to 245°C Lead Free Solder Processes = Reflow solder capable to 260°C Lead Free Solder Processes = Pin-in-Paste capable to 245°C Lead Free Solder Processes = Pin-in-Paste capable to 260°C Mating Pin Dia. Range = .36 - .66 mm Socket Length = 6.60 mm Sleeve Style = Closed Bottom Gold Flash over Nickel Sleeve Plating Material Gold (30) Contact Spring Plating Production Application Without Sealant Insertion Method = Hand/Semi-Automatic Packaging Method = Loose Piece Always was RoHS compliant Copper Sleeve Material Beryllium Copper Spring Material Recommended Hole Size = 1.32 mm
View Product Details for 50863-4
	50864-1 Active Add to Part List	Government/Industry Qualification = No Not ELV/RoHS compliant Lead Free Solder Processes = Wave solder capable to 240°C Lead Free Solder Processes = Wave solder capable to 260°C Lead Free Solder Processes = Wave solder capable to 265°C Lead Free Solder Processes = Reflow solder capable to 245°C Lead Free Solder Processes = Reflow solder capable to 260°C Lead Free Solder Processes = Pin-in-Paste capable to 245°C Lead Free Solder Processes = Pin-in-Paste capable to 260°C Mating Pin Dia. Range = .66 - .84 mm Socket Length = 6.53 mm Sleeve Style = Closed Bottom Tin Sleeve Plating Material Gold (30) Contact Spring Plating Production Application Without Sealant Insertion Method = Hand/Semi-Automatic/Automatic Packaging Method = Loose Piece Copper Sleeve Material Beryllium Copper Spring Material Recommended Hole Size = 1.57 mm
View Product Details for 50864-1
	50864-6 Active Add to Part List	Government/Industry Qualification = No Not ELV/RoHS compliant Lead Free Solder Processes = Wave solder capable to 240°C Lead Free Solder Processes = Wave solder capable to 260°C Lead Free Solder Processes = Wave solder capable to 265°C Lead Free Solder Processes = Reflow solder capable to 245°C Lead Free Solder Processes = Reflow solder capable to 260°C Lead Free Solder Processes = Pin-in-Paste capable to 245°C Lead Free Solder Processes = Pin-in-Paste capable to 260°C Mating Pin Dia. Range = .66 - .84 mm Socket Length = 6.53 mm Sleeve Style = Closed Bottom Tin Sleeve Plating Material Tin Contact Spring Plating Production Application Without Sealant Insertion Method = Hand/Semi-Automatic/Automatic Packaging Method = Loose Piece Copper Sleeve Material Beryllium Copper Spring Material Recommended Hole Size = 1.57 mm
View Product Details for 50864-6
	50865 Active Add to Part List	Government/Industry Qualification = No RoHS compliant ELV compliant Lead Free Solder Processes = Wave solder capable to 240°C Lead Free Solder Processes = Wave solder capable to 260°C Lead Free Solder Processes = Wave solder capable to 265°C Lead Free Solder Processes = Reflow solder capable to 245°C Lead Free Solder Processes = Reflow solder capable to 260°C Lead Free Solder Processes = Pin-in-Paste capable to 245°C Lead Free Solder Processes = Pin-in-Paste capable to 260°C Mating Pin Dia. Range = .79 - 1.04 mm Socket Length = 6.60 mm Sleeve Style = Closed Bottom Gold Flash over Nickel Sleeve Plating Material Gold (30) Contact Spring Plating Production Application Without Sealant Insertion Method = Hand/Semi-Automatic Packaging Method = Loose Piece Always was RoHS compliant Copper Sleeve Material Beryllium Copper Spring Material Recommended Hole Size = 1.80 mm
View Product Details for 50865
	50865-5 Active Add to Part List	Government/Industry Qualification = No Not ELV/RoHS compliant Lead Free Solder Processes = Wave solder capable to 240°C Lead Free Solder Processes = Wave solder capable to 260°C Lead Free Solder Processes = Wave solder capable to 265°C Lead Free Solder Processes = Reflow solder capable to 245°C Lead Free Solder Processes = Reflow solder capable to 260°C Lead Free Solder Processes = Pin-in-Paste capable to 245°C Lead Free Solder Processes = Pin-in-Paste capable to 260°C Mating Pin Dia. Range = .79 - 1.04 mm Socket Length = 6.60 mm Sleeve Style = Closed Bottom Tin Sleeve Plating Material Gold (30) Contact Spring Plating Production Application Without Sealant Insertion Method = Hand/Semi-Automatic Packaging Method = Loose Piece Copper Sleeve Material Beryllium Copper Spring Material Recommended Hole Size = 1.80 mm
View Product Details for 50865-5
	50871-1 Active Add to Part List	Government/Industry Qualification = No Not ELV/RoHS compliant Lead Free Solder Processes = Wave solder capable to 240°C Lead Free Solder Processes = Wave solder capable to 260°C Lead Free Solder Processes = Wave solder capable to 265°C Lead Free Solder Processes = Reflow solder capable to 245°C Lead Free Solder Processes = Reflow solder capable to 260°C Lead Free Solder Processes = Pin-in-Paste capable to 245°C Lead Free Solder Processes = Pin-in-Paste capable to 260°C Mating Pin Dia. Range = 1.07 - 1.24 mm Socket Length = 7.32 mm Sleeve Style = Open Bottom Tin Sleeve Plating Material Gold (30) Contact Spring Plating Production Application Without Sealant Insertion Method = Hand/Semi-Automatic Packaging Method = Loose Piece Copper Sleeve Material Beryllium Copper Spring Material Recommended Hole Size = 2.59 mm
View Product Details for 50871-1
	50871-8 Active Add to Part List	Government/Industry Qualification = No Not ELV/RoHS compliant Lead Free Solder Processes = Wave solder capable to 240°C Lead Free Solder Processes = Wave solder capable to 260°C Lead Free Solder Processes = Wave solder capable to 265°C Lead Free Solder Processes = Reflow solder capable to 245°C Lead Free Solder Processes = Reflow solder capable to 260°C Lead Free Solder Processes = Pin-in-Paste capable to 245°C Lead Free Solder Processes = Pin-in-Paste capable to 260°C Mating Pin Dia. Range = 1.07 - 1.24 mm Socket Length = 7.32 mm Sleeve Style = Closed Bottom Tin Sleeve Plating Material Tin Contact Spring Plating Production Application Without Sealant Insertion Method = Hand/Semi-Automatic Packaging Method = Loose Piece Copper Sleeve Material Beryllium Copper Spring Material Recommended Hole Size = 2.59 mm
View Product Details for 50871-8
	1-50871-3 Active Add to Part List	Government/Industry Qualification = No RoHS compliant ELV compliant Lead Free Solder Processes = Wave solder capable to 240°C Lead Free Solder Processes = Wave solder capable to 260°C Lead Free Solder Processes = Wave solder capable to 265°C Lead Free Solder Processes = Reflow solder capable to 245°C Lead Free Solder Processes = Reflow solder capable to 260°C Lead Free Solder Processes = Pin-in-Paste capable to 245°C Lead Free Solder Processes = Pin-in-Paste capable to 260°C Mating Pin Dia. Range = 1.27 - 1.45 mm Socket Length = 7.32 mm Sleeve Style = Closed Bottom Gold Flash over Nickel Sleeve Plating Material Gold (30) Contact Spring Plating Production Application Without Sealant Insertion Method = Hand/Semi-Automatic Packaging Method = Loose Piece Always was RoHS compliant Copper Sleeve Material Beryllium Copper Spring Material Recommended Hole Size = 2.59 mm
View Product Details for 1-50871-3
	1-50871-8 Active Add to Part List	Government/Industry Qualification = No RoHS compliant ELV compliant Lead Free Solder Processes = Wave solder capable to 240°C Lead Free Solder Processes = Wave solder capable to 260°C Lead Free Solder Processes = Wave solder capable to 265°C Lead Free Solder Processes = Reflow solder capable to 245°C Lead Free Solder Processes = Reflow solder capable to 260°C Lead Free Solder Processes = Pin-in-Paste capable to 245°C Lead Free Solder Processes = Pin-in-Paste capable to 260°C Mating Pin Dia. Range = 1.42 - 1.65 mm Socket Length = 7.32 mm Sleeve Style = Open Bottom Gold Flash over Nickel Sleeve Plating Material Gold (30) Contact Spring Plating Production Application Without Sealant Insertion Method = Hand/Semi-Automatic Packaging Method = Loose Piece Always was RoHS compliant Copper Sleeve Material Beryllium Copper Spring Material Recommended Hole Size = 2.59 mm
View Product Details for 1-50871-8
	1-50871-9 Active Add to Part List	Government/Industry Qualification = No Not ELV/RoHS compliant Lead Free Solder Processes = Wave solder capable to 240°C Lead Free Solder Processes = Wave solder capable to 260°C Lead Free Solder Processes = Wave solder capable to 265°C Lead Free Solder Processes = Reflow solder capable to 245°C Lead Free Solder Processes = Reflow solder capable to 260°C Lead Free Solder Processes = Pin-in-Paste capable to 245°C Lead Free Solder Processes = Pin-in-Paste capable to 260°C Mating Pin Dia. Range = 1.42 - 1.65 mm Socket Length = 7.32 mm Sleeve Style = Open Bottom Tin Sleeve Plating Material Gold (30) Contact Spring Plating Production Application Without Sealant Insertion Method = Hand/Semi-Automatic Packaging Method = Loose Piece Copper Sleeve Material Beryllium Copper Spring Material Recommended Hole Size = 2.59 mm
View Product Details for 1-50871-9
	2-330808-8 Active Add to Part List	Government/Industry Qualification = No RoHS compliant ELV compliant Lead Free Solder Processes = Wave solder capable to 240°C Lead Free Solder Processes = Wave solder capable to 260°C Lead Free Solder Processes = Wave solder capable to 265°C Lead Free Solder Processes = Reflow solder capable to 245°C Lead Free Solder Processes = Reflow solder capable to 260°C Lead Free Solder Processes = Pin-in-Paste capable to 245°C Lead Free Solder Processes = Pin-in-Paste capable to 260°C Mating Pin Dia. Range = .33 - .51 mm Socket Length = 3.61 mm Sleeve Style = Closed Bottom Gold Flash over Nickel Sleeve Plating Material Gold (30) Contact Spring Plating Production Application Without Sealant Insertion Method = Hand/Semi-Automatic Packaging Method = Loose Piece Always was RoHS compliant Copper Sleeve Material Beryllium Copper Spring Material Recommended Hole Size = 1.04 mm
View Product Details for 2-330808-8
	3-330808-8 Active Add to Part List	Government/Industry Qualification = No RoHS compliant ELV compliant Lead Free Solder Processes = Wave solder capable to 240°C Lead Free Solder Processes = Wave solder capable to 260°C Lead Free Solder Processes = Wave solder capable to 265°C Lead Free Solder Processes = Reflow solder capable to 245°C Lead Free Solder Processes = Reflow solder capable to 260°C Lead Free Solder Processes = Pin-in-Paste capable to 245°C Lead Free Solder Processes = Pin-in-Paste capable to 260°C Mating Pin Dia. Range = .33 - .51 mm Socket Length = 3.61 mm Sleeve Style = Knockout Bottom Gold Flash over Nickel Sleeve Plating Material Gold (30) Contact Spring Plating Production Application Without Sealant Insertion Method = Hand/Semi-Automatic Packaging Method = Loose Piece Always was RoHS compliant Copper Sleeve Material Beryllium Copper Spring Material Recommended Hole Size = 1.04 mm
View Product Details for 3-330808-8
	2-331272-6 Active Add to Part List	Government/Industry Qualification = No RoHS compliant ELV compliant Lead Free Solder Processes = Wave solder capable to 240°C Lead Free Solder Processes = Wave solder capable to 260°C Lead Free Solder Processes = Wave solder capable to 265°C Lead Free Solder Processes = Reflow solder capable to 245°C Lead Free Solder Processes = Reflow solder capable to 260°C Lead Free Solder Processes = Pin-in-Paste capable to 245°C Lead Free Solder Processes = Pin-in-Paste capable to 260°C Mating Pin Dia. Range = .56 - .64 mm Socket Length = 3.51 mm Sleeve Style = Closed Bottom Gold Flash over Nickel Sleeve Plating Material Gold (30) Contact Spring Plating Production Application Without Sealant Insertion Method = Hand/Semi-Automatic Packaging Method = Loose Piece Always was RoHS compliant Copper Sleeve Material Beryllium Copper Spring Material Recommended Hole Size = 1.32 mm
View Product Details for 2-331272-6
	2-331272-7 Active Add to Part List	Government/Industry Qualification = No Not ELV/RoHS compliant Lead Free Solder Processes = Wave solder capable to 240°C Lead Free Solder Processes = Wave solder capable to 260°C Lead Free Solder Processes = Wave solder capable to 265°C Lead Free Solder Processes = Reflow solder capable to 245°C Lead Free Solder Processes = Reflow solder capable to 260°C Lead Free Solder Processes = Pin-in-Paste capable to 245°C Lead Free Solder Processes = Pin-in-Paste capable to 260°C Mating Pin Dia. Range = .56 - .64 mm Socket Length = 3.51 mm Sleeve Style = Closed Bottom Tin Sleeve Plating Material Gold (30) Contact Spring Plating Production Application Without Sealant Insertion Method = Hand/Semi-Automatic Packaging Method = Loose Piece Copper Sleeve Material Beryllium Copper Spring Material Recommended Hole Size = 1.32 mm
View Product Details for 2-331272-7
	1-331677-4 Active Add to Part List	Government/Industry Qualification = No RoHS compliant ELV compliant Lead Free Solder Processes = Wave solder capable to 240°C Lead Free Solder Processes = Wave solder capable to 260°C Lead Free Solder Processes = Wave solder capable to 265°C Lead Free Solder Processes = Reflow solder capable to 245°C Lead Free Solder Processes = Reflow solder capable to 260°C Lead Free Solder Processes = Pin-in-Paste capable to 245°C Lead Free Solder Processes = Pin-in-Paste capable to 260°C Mating Pin Dia. Range = .76 - .84 mm Socket Length = 3.51 mm Sleeve Style = Closed Bottom Gold Flash over Nickel Sleeve Plating Material Gold (30) Contact Spring Plating Production Application Without Sealant Insertion Method = Hand/Semi-Automatic/Automatic Packaging Method = Loose Piece Always was RoHS compliant Copper Sleeve Material Beryllium Copper Spring Material Recommended Hole Size = 1.57 mm
View Product Details for 1-331677-4
	2-331677-9 Active Add to Part List	Government/Industry Qualification = No RoHS compliant ELV compliant Lead Free Solder Processes = Wave solder capable to 240°C Lead Free Solder Processes = Wave solder capable to 260°C Lead Free Solder Processes = Wave solder capable to 265°C Lead Free Solder Processes = Reflow solder capable to 245°C Lead Free Solder Processes = Reflow solder capable to 260°C Lead Free Solder Processes = Pin-in-Paste capable to 245°C Lead Free Solder Processes = Pin-in-Paste capable to 260°C Mating Pin Dia. Range = .76 - .84 mm Socket Length = 3.51 mm Sleeve Style = Knockout Bottom Gold Flash over Nickel Sleeve Plating Material Gold (30) Contact Spring Plating Production Application Without Sealant Insertion Method = Hand/Semi-Automatic/Automatic Packaging Method = Loose Piece Always was RoHS compliant Copper Sleeve Material Beryllium Copper Spring Material Recommended Hole Size = 1.57 mm
View Product Details for 2-331677-9
	2-332070-3 Active Add to Part List	Government/Industry Qualification = No Not ELV/RoHS compliant Lead Free Solder Processes = Wave solder capable to 240°C Lead Free Solder Processes = Wave solder capable to 260°C Lead Free Solder Processes = Wave solder capable to 265°C Lead Free Solder Processes = Reflow solder capable to 245°C Lead Free Solder Processes = Reflow solder capable to 260°C Lead Free Solder Processes = Pin-in-Paste capable to 245°C Lead Free Solder Processes = Pin-in-Paste capable to 260°C Mating Pin Dia. Range = .94 - 1.02 mm Socket Length = 3.63 mm Sleeve Style = Closed Bottom Tin Sleeve Plating Material Gold (30) Contact Spring Plating Production Application Without Sealant Insertion Method = Hand/Semi-Automatic Packaging Method = Loose Piece Beryllium Copper Spring Material Recommended Hole Size = 1.83 mm
View Product Details for 2-332070-3
	2-332095-1 Active Add to Part List	Government/Industry Qualification = No RoHS compliant ELV compliant Lead Free Solder Processes = Wave solder capable to 240°C Lead Free Solder Processes = Wave solder capable to 260°C Lead Free Solder Processes = Wave solder capable to 265°C Lead Free Solder Processes = Reflow solder capable to 245°C Lead Free Solder Processes = Reflow solder capable to 260°C Lead Free Solder Processes = Pin-in-Paste capable to 245°C Lead Free Solder Processes = Pin-in-Paste capable to 260°C Mating Pin Dia. Range = .33 - .51 mm Socket Length = 4.52 mm Sleeve Style = Closed Bottom Gold Flash over Nickel Sleeve Plating Material Gold (30) Contact Spring Plating Production Application Without Sealant Insertion Method = Hand/Semi-Automatic Packaging Method = Loose Piece Always was RoHS compliant Copper Sleeve Material Beryllium Copper Spring Material Recommended Hole Size = 1.04 mm
View Product Details for 2-332095-1
	380598-1 Active Add to Part List	Government/Industry Qualification = No RoHS compliant ELV compliant Lead Free Solder Processes = Wave solder capable to 240°C Lead Free Solder Processes = Wave solder capable to 260°C Lead Free Solder Processes = Wave solder capable to 265°C Lead Free Solder Processes = Reflow solder capable to 245°C Lead Free Solder Processes = Reflow solder capable to 260°C Lead Free Solder Processes = Pin-in-Paste capable to 245°C Lead Free Solder Processes = Pin-in-Paste capable to 260°C Mating Pin Dia. Range = .46 - 1.02 mm Socket Length = 6.65 mm Sleeve Style = Closed Bottom Gold (30) Sleeve Plating Material Gold (30) Contact Spring Plating Testing/Reusable Application Without Sealant Insertion Method = Hand/Semi-Automatic Packaging Method = Loose Piece Always was RoHS compliant Copper Sleeve Material Recommended Hole Size = 2.26 mm
View Product Details for 380598-1
	380598-2 Active Add to Part List	Government/Industry Qualification = No Not ELV/RoHS compliant Lead Free Solder Processes = Wave solder capable to 240°C Lead Free Solder Processes = Wave solder capable to 260°C Lead Free Solder Processes = Wave solder capable to 265°C Lead Free Solder Processes = Reflow solder capable to 245°C Lead Free Solder Processes = Reflow solder capable to 260°C Lead Free Solder Processes = Pin-in-Paste capable to 245°C Lead Free Solder Processes = Pin-in-Paste capable to 260°C Mating Pin Dia. Range = .46 - 1.02 mm Socket Length = 6.65 mm Sleeve Style = Closed Bottom Tin Sleeve Plating Material Gold (30) Contact Spring Plating Testing/Reusable Application Without Sealant Insertion Method = Hand/Semi-Automatic Packaging Method = Loose Piece Copper Sleeve Material Recommended Hole Size = 2.26 mm
View Product Details for 380598-2
	380635-1 Active Add to Part List	Government/Industry Qualification = No RoHS compliant ELV compliant Lead Free Solder Processes = Wave solder capable to 240°C Lead Free Solder Processes = Wave solder capable to 260°C Lead Free Solder Processes = Wave solder capable to 265°C Lead Free Solder Processes = Reflow solder capable to 245°C Lead Free Solder Processes = Reflow solder capable to 260°C Lead Free Solder Processes = Pin-in-Paste capable to 245°C Lead Free Solder Processes = Pin-in-Paste capable to 260°C Mating Pin Dia. Range = .46 - 1.02 mm Socket Length = 6.45 mm Sleeve Style = Open Bottom Gold (30) Sleeve Plating Material Gold (30) Contact Spring Plating Testing/Reusable Application Without Sealant Insertion Method = Hand/Semi-Automatic Packaging Method = Loose Piece Always was RoHS compliant Copper Sleeve Material Recommended Hole Size = 2.26 mm
View Product Details for 380635-1
	1-645986-2 Active Add to Part List	Government/Industry Qualification = No Not ELV/RoHS compliant Lead Free Solder Processes = Wave solder capable to 240°C Lead Free Solder Processes = Wave solder capable to 260°C Lead Free Solder Processes = Wave solder capable to 265°C Lead Free Solder Processes = Reflow solder capable to 245°C Lead Free Solder Processes = Reflow solder capable to 260°C Lead Free Solder Processes = Pin-in-Paste capable to 245°C Lead Free Solder Processes = Pin-in-Paste capable to 260°C Mating Pin Dia. Range = .71 - .84 mm Socket Length = 7.37 mm Sleeve Style = Bullet Nose Tin Sleeve Plating Material Gold (30) Contact Spring Plating Production Application With Sealant Insertion Method = Hand/Semi-Automatic/Automatic Packaging Method = Carrier Tape Copper Sleeve Material Beryllium Copper Spring Material Recommended Hole Size = 1.57 mm
View Product Details for 1-645986-2
	3-331272-8 Active Add to Part List	Government/Industry Qualification = No RoHS compliant ELV compliant Lead Free Solder Processes = Wave solder capable to 240°C Lead Free Solder Processes = Wave solder capable to 260°C Lead Free Solder Processes = Wave solder capable to 265°C Lead Free Solder Processes = Reflow solder capable to 245°C Lead Free Solder Processes = Reflow solder capable to 260°C Lead Free Solder Processes = Pin-in-Paste capable to 245°C Lead Free Solder Processes = Pin-in-Paste capable to 260°C Mating Pin Dia. Range = .46 - .51 mm Socket Length = 3.51 mm Sleeve Style = Open Bottom Gold Flash over Nickel Sleeve Plating Material Gold (30) Contact Spring Plating Production Application Without Sealant Insertion Method = Hand/Semi-Automatic Packaging Method = Loose Piece Always was RoHS compliant Copper Sleeve Material Beryllium Copper Spring Material Recommended Hole Size = 1.32 mm
View Product Details for 3-331272-8
	50863 Active Add to Part List	Government/Industry Qualification = No RoHS compliant ELV compliant Lead Free Solder Processes = Wave solder capable to 240°C Lead Free Solder Processes = Wave solder capable to 260°C Lead Free Solder Processes = Wave solder capable to 265°C Lead Free Solder Processes = Reflow solder capable to 245°C Lead Free Solder Processes = Reflow solder capable to 260°C Lead Free Solder Processes = Pin-in-Paste capable to 245°C Lead Free Solder Processes = Pin-in-Paste capable to 260°C Mating Pin Dia. Range = .36 - .66 mm Socket Length = 6.60 mm Sleeve Style = Open Bottom Gold Flash over Nickel Sleeve Plating Material Gold (30) Contact Spring Plating Production Application Without Sealant Insertion Method = Hand/Semi-Automatic Packaging Method = Loose Piece Always was RoHS compliant Copper Sleeve Material Beryllium Copper Spring Material Recommended Hole Size = 1.32 mm
View Product Details for 50863
	1-645955-1 Active Add to Part List	Government/Industry Qualification = No Not ELV/RoHS compliant Lead Free Solder Processes = Wave solder capable to 240°C Lead Free Solder Processes = Wave solder capable to 260°C Lead Free Solder Processes = Wave solder capable to 265°C Lead Free Solder Processes = Reflow solder capable to 245°C Lead Free Solder Processes = Reflow solder capable to 260°C Lead Free Solder Processes = Pin-in-Paste capable to 245°C Lead Free Solder Processes = Pin-in-Paste capable to 260°C Mating Pin Dia. Range = .36 - .66 mm Socket Length = 4.67 mm Sleeve Style = Bullet Nose Tin Sleeve Plating Material Tin Contact Spring Plating Production Application With Sealant Insertion Method = Hand/Semi-Automatic/Automatic Packaging Method = Reel Silicon Rubber Seal Material Copper Sleeve Material Beryllium Copper Spring Material Recommended Hole Size = 1.32 mm Packaging Quantity = 10,000/Reel
View Product Details for 1-645955-1
	2-330808-7 Active Add to Part List	Government/Industry Qualification = No Not ELV/RoHS compliant Lead Free Solder Processes = Wave solder capable to 240°C Lead Free Solder Processes = Wave solder capable to 260°C Lead Free Solder Processes = Wave solder capable to 265°C Lead Free Solder Processes = Reflow solder capable to 245°C Lead Free Solder Processes = Reflow solder capable to 260°C Lead Free Solder Processes = Pin-in-Paste capable to 245°C Lead Free Solder Processes = Pin-in-Paste capable to 260°C Mating Pin Dia. Range = .33 - .51 mm Socket Length = 3.61 mm Sleeve Style = Closed Bottom Tin Sleeve Plating Material Tin Contact Spring Plating Production Application Without Sealant Insertion Method = Hand/Semi-Automatic Packaging Method = Loose Piece Copper Sleeve Material Beryllium Copper Spring Material Recommended Hole Size = 1.04 mm
View Product Details for 2-330808-7
	6-330808-5 Active Add to Part List	Government/Industry Qualification = No Not ELV/RoHS compliant Lead Free Solder Processes = Wave solder capable to 240°C Lead Free Solder Processes = Wave solder capable to 260°C Lead Free Solder Processes = Wave solder capable to 265°C Lead Free Solder Processes = Reflow solder capable to 245°C Lead Free Solder Processes = Reflow solder capable to 260°C Lead Free Solder Processes = Pin-in-Paste capable to 245°C Lead Free Solder Processes = Pin-in-Paste capable to 260°C Mating Pin Dia. Range = .33 - .51 mm Socket Length = 3.61 mm Sleeve Style = Closed Bottom Tin Sleeve Plating Material Gold (30) Contact Spring Plating Production Application Without Sealant Insertion Method = Hand/Semi-Automatic Packaging Method = Loose Piece Copper Sleeve Material Beryllium Copper Spring Material Recommended Hole Size = 1.04 mm
View Product Details for 6-330808-5
	2-50871-2 Active Add to Part List	Government/Industry Qualification = No RoHS compliant ELV compliant Lead Free Solder Processes = Wave solder capable to 240°C Lead Free Solder Processes = Wave solder capable to 260°C Lead Free Solder Processes = Wave solder capable to 265°C Lead Free Solder Processes = Reflow solder capable to 245°C Lead Free Solder Processes = Reflow solder capable to 260°C Lead Free Solder Processes = Pin-in-Paste capable to 245°C Lead Free Solder Processes = Pin-in-Paste capable to 260°C Mating Pin Dia. Range = 1.42 - 1.65 mm Socket Length = 7.32 mm Sleeve Style = Closed Bottom Gold Flash over Nickel Sleeve Plating Material Gold (30) Contact Spring Plating Production Application Without Sealant Insertion Method = Hand/Semi-Automatic Packaging Method = Loose Piece Always was RoHS compliant Copper Sleeve Material Beryllium Copper Spring Material Recommended Hole Size = 2.59 mm
View Product Details for 2-50871-2
	50864-5 Active Add to Part List	Government/Industry Qualification = No Not ELV/RoHS compliant Lead Free Solder Processes = Wave solder capable to 240°C Lead Free Solder Processes = Wave solder capable to 260°C Lead Free Solder Processes = Wave solder capable to 265°C Lead Free Solder Processes = Reflow solder capable to 245°C Lead Free Solder Processes = Reflow solder capable to 260°C Lead Free Solder Processes = Pin-in-Paste capable to 245°C Lead Free Solder Processes = Pin-in-Paste capable to 260°C Mating Pin Dia. Range = .66 - .84 mm Socket Length = 6.53 mm Sleeve Style = Open Bottom Tin Sleeve Plating Material Gold (30) Contact Spring Plating Production Application Without Sealant Insertion Method = Hand/Semi-Automatic/Automatic Packaging Method = Loose Piece Copper Sleeve Material Beryllium Copper Spring Material Recommended Hole Size = 1.57 mm
View Product Details for 50864-5
	2-331677-2 Active Add to Part List	Government/Industry Qualification = No Not ELV/RoHS compliant Lead Free Solder Processes = Wave solder capable to 240°C Lead Free Solder Processes = Wave solder capable to 260°C Lead Free Solder Processes = Wave solder capable to 265°C Lead Free Solder Processes = Reflow solder capable to 245°C Lead Free Solder Processes = Reflow solder capable to 260°C Lead Free Solder Processes = Pin-in-Paste capable to 245°C Lead Free Solder Processes = Pin-in-Paste capable to 260°C Mating Pin Dia. Range = .76 - .84 mm Socket Length = 3.51 mm Sleeve Style = Open Bottom Tin Sleeve Plating Material Gold (30) Contact Spring Plating Production Application Without Sealant Insertion Method = Hand/Semi-Automatic/Automatic Packaging Method = Loose Piece Copper Sleeve Material Beryllium Copper Spring Material Recommended Hole Size = 1.57 mm
View Product Details for 2-331677-2
	2-331677-6 Active Add to Part List	Government/Industry Qualification = No RoHS compliant ELV compliant Lead Free Solder Processes = Wave solder capable to 240°C Lead Free Solder Processes = Wave solder capable to 260°C Lead Free Solder Processes = Wave solder capable to 265°C Lead Free Solder Processes = Reflow solder capable to 245°C Lead Free Solder Processes = Reflow solder capable to 260°C Lead Free Solder Processes = Pin-in-Paste capable to 245°C Lead Free Solder Processes = Pin-in-Paste capable to 260°C Mating Pin Dia. Range = .76 - .84 mm Socket Length = 3.51 mm Sleeve Style = Open Bottom Gold Flash over Nickel Sleeve Plating Material Gold (30) Contact Spring Plating Production Application Without Sealant Insertion Method = Hand/Semi-Automatic/Automatic Packaging Method = Loose Piece Always was RoHS compliant Copper Sleeve Material Beryllium Copper Spring Material Recommended Hole Size = 1.57 mm
View Product Details for 2-331677-6
	1-332070-4 Active Add to Part List	Government/Industry Qualification = No RoHS compliant ELV compliant Lead Free Solder Processes = Wave solder capable to 240°C Lead Free Solder Processes = Wave solder capable to 260°C Lead Free Solder Processes = Wave solder capable to 265°C Lead Free Solder Processes = Reflow solder capable to 245°C Lead Free Solder Processes = Reflow solder capable to 260°C Lead Free Solder Processes = Pin-in-Paste capable to 245°C Lead Free Solder Processes = Pin-in-Paste capable to 260°C Mating Pin Dia. Range = .94 - 1.02 mm Socket Length = 3.63 mm Sleeve Style = Open Bottom Gold Flash over Nickel Sleeve Plating Material Gold (30) Contact Spring Plating Production Application Without Sealant Insertion Method = Hand/Semi-Automatic Packaging Method = Loose Piece Always was RoHS compliant Beryllium Copper Spring Material Recommended Hole Size = 1.83 mm
View Product Details for 1-332070-4
	50935 Active Add to Part List	Government/Industry Qualification = No RoHS compliant ELV compliant Lead Free Solder Processes = Wave solder capable to 240°C Lead Free Solder Processes = Wave solder capable to 260°C Lead Free Solder Processes = Wave solder capable to 265°C Lead Free Solder Processes = Reflow solder capable to 245°C Lead Free Solder Processes = Reflow solder capable to 260°C Lead Free Solder Processes = Pin-in-Paste capable to 245°C Lead Free Solder Processes = Pin-in-Paste capable to 260°C Mating Pin Dia. Range = .33 - .51 mm Socket Length = 4.27 mm Sleeve Style = Closed Bottom Gold (30) Sleeve Plating Material Gold Flash Contact Spring Plating Production Application Without Sealant Insertion Method = Hand/Semi-Automatic Packaging Method = Loose Piece Always was RoHS compliant Copper Sleeve Material Beryllium Copper Spring Material
View Product Details for 50935
	No Image Available M8134-HC-5P2 Active Add to Part List	Government/Industry Qualification = Yes M83505/6-001 RoHS compliant ELV compliant Lead Free Solder Processes = Not relevant for lead free process Mating Pin Dia. Range = .28 - .46 mm Socket Length = 2.54 mm Gold Contact Spring Plating Production Application Without Sealant Insertion Method = Hand/Semi-Automatic Packaging Method = Loose Piece Always was RoHS compliant Proprietary Name = HOLTITE Beryllium Copper Spring Material Recommended Hole Size = 1.04 mm
View Product Details for M8134-HC-5P2
	No Image Available M8134-HC-8P2 Active Add to Part List	Government/Industry Qualification = Yes M83505/6-003 RoHS compliant ELV compliant Lead Free Solder Processes = Not relevant for lead free process Mating Pin Dia. Range = .64 - .89 mm Socket Length = 3.56 mm Gold Contact Spring Plating Production Application Without Sealant Insertion Method = Hand/Semi-Automatic Packaging Method = Loose Piece Always was RoHS compliant Proprietary Name = HOLTITE Beryllium Copper Spring Material Recommended Hole Size = 1.47 mm
View Product Details for M8134-HC-8P2
	No Image Available 322-HCS8P2-100 Active Add to Part List	Government/Industry Qualification = No RoHS compliant ELV compliant Lead Free Solder Processes = Not relevant for lead free process Mating Pin Dia. Range = .64 - .89 mm Socket Length = 3.56 mm Gold Contact Spring Plating Production Application Without Sealant Insertion Method = Hand/Semi-Automatic/Automatic Packaging Method = Reel Always was RoHS compliant Proprietary Name = HOLTITE Beryllium Copper Spring Material Recommended Hole Size = 1.61 mm Packaging Quantity = 2,500/Reel
View Product Details for 322-HCS8P2-100
	1-5331677-6 Active Add to Part List	Government/Industry Qualification = No RoHS compliant ELV compliant Lead Free Solder Processes = Wave solder capable to 240°C Lead Free Solder Processes = Wave solder capable to 260°C Lead Free Solder Processes = Wave solder capable to 265°C Lead Free Solder Processes = Reflow solder capable to 245°C Lead Free Solder Processes = Reflow solder capable to 260°C Lead Free Solder Processes = Pin-in-Paste capable to 245°C Lead Free Solder Processes = Pin-in-Paste capable to 260°C Mating Pin Dia. Range = .56 - .64 mm Socket Length = 3.51 mm Sleeve Style = Closed Bottom Tin Sleeve Plating Material Tin Contact Spring Plating Production Application Without Sealant Insertion Method = Hand/Semi-Automatic/Automatic Packaging Method = Loose Piece Always was RoHS compliant Copper Sleeve Material Beryllium Copper Spring Material Recommended Hole Size = 1.57 mm
View Product Details for 1-5331677-6
	1-5332095-9 Active Add to Part List	Government/Industry Qualification = No RoHS compliant ELV compliant Lead Free Solder Processes = Wave solder capable to 240°C Lead Free Solder Processes = Wave solder capable to 260°C Lead Free Solder Processes = Wave solder capable to 265°C Lead Free Solder Processes = Reflow solder capable to 245°C Lead Free Solder Processes = Reflow solder capable to 260°C Lead Free Solder Processes = Pin-in-Paste capable to 245°C Lead Free Solder Processes = Pin-in-Paste capable to 260°C Mating Pin Dia. Range = .33 - .51 mm Socket Length = 4.52 mm Sleeve Style = Knockout Bottom Tin Sleeve Plating Material Gold (30) Contact Spring Plating Production Application Without Sealant Insertion Method = Hand/Semi-Automatic Packaging Method = Loose Piece Always was RoHS compliant Copper Sleeve Material Beryllium Copper Spring Material Recommended Hole Size = 1.04 mm
View Product Details for 1-5332095-9
	1-5380758-0 Active Add to Part List	Government/Industry Qualification = No RoHS compliant ELV compliant Lead Free Solder Processes = Wave solder capable to 240°C Lead Free Solder Processes = Wave solder capable to 260°C Lead Free Solder Processes = Wave solder capable to 265°C Lead Free Solder Processes = Reflow solder capable to 245°C Lead Free Solder Processes = Reflow solder capable to 260°C Lead Free Solder Processes = Pin-in-Paste capable to 245°C Lead Free Solder Processes = Pin-in-Paste capable to 260°C Mating Pin Dia. Range = .91 - 1.30 mm Socket Length = 6.65 mm Sleeve Style = Closed Bottom Tin Sleeve Plating Material Tin Contact Spring Plating Testing/Reusable Application Without Sealant Insertion Method = Hand/Semi-Automatic Packaging Method = Loose Piece Always was RoHS compliant Copper Sleeve Material Recommended Hole Size = 2.26 mm
View Product Details for 1-5380758-0
	1-5380758-1 Active Add to Part List	Government/Industry Qualification = No RoHS compliant ELV compliant Lead Free Solder Processes = Wave solder capable to 240°C Lead Free Solder Processes = Wave solder capable to 260°C Lead Free Solder Processes = Wave solder capable to 265°C Lead Free Solder Processes = Reflow solder capable to 245°C Lead Free Solder Processes = Reflow solder capable to 260°C Lead Free Solder Processes = Pin-in-Paste capable to 245°C Lead Free Solder Processes = Pin-in-Paste capable to 260°C Mating Pin Dia. Range = .91 - 1.30 mm Socket Length = 6.65 mm Sleeve Style = Closed Bottom Tin Sleeve Plating Material Gold (30) Contact Spring Plating Testing/Reusable Application Without Sealant Insertion Method = Hand/Semi-Automatic Packaging Method = Loose Piece Always was RoHS compliant Copper Sleeve Material Recommended Hole Size = 2.26 mm
View Product Details for 1-5380758-1
	1-5050871-0 Active Add to Part List	Government/Industry Qualification = No RoHS compliant ELV compliant Lead Free Solder Processes = Wave solder capable to 240°C Lead Free Solder Processes = Wave solder capable to 260°C Lead Free Solder Processes = Wave solder capable to 265°C Lead Free Solder Processes = Reflow solder capable to 245°C Lead Free Solder Processes = Reflow solder capable to 260°C Lead Free Solder Processes = Pin-in-Paste capable to 245°C Lead Free Solder Processes = Pin-in-Paste capable to 260°C Mating Pin Dia. Range = 1.27 - 1.45 mm Socket Length = 7.32 mm Sleeve Style = Open Bottom Tin Sleeve Plating Material Gold (30) Contact Spring Plating Production Application Without Sealant Insertion Method = Hand/Semi-Automatic Packaging Method = Loose Piece Always was RoHS compliant Copper Sleeve Material Beryllium Copper Spring Material Recommended Hole Size = 2.59 mm
View Product Details for 1-5050871-0
	1-5050871-9 Active Add to Part List	Government/Industry Qualification = No RoHS compliant ELV compliant Lead Free Solder Processes = Wave solder capable to 240°C Lead Free Solder Processes = Wave solder capable to 260°C Lead Free Solder Processes = Wave solder capable to 265°C Lead Free Solder Processes = Reflow solder capable to 245°C Lead Free Solder Processes = Reflow solder capable to 260°C Lead Free Solder Processes = Pin-in-Paste capable to 245°C Lead Free Solder Processes = Pin-in-Paste capable to 260°C Mating Pin Dia. Range = 1.42 - 1.65 mm Socket Length = 7.32 mm Sleeve Style = Open Bottom Tin Sleeve Plating Material Gold (30) Contact Spring Plating Production Application Without Sealant Insertion Method = Hand/Semi-Automatic Packaging Method = Loose Piece Always was RoHS compliant Copper Sleeve Material Beryllium Copper Spring Material Recommended Hole Size = 2.59 mm
View Product Details for 1-5050871-9
	2-5330808-7 Active Add to Part List	Government/Industry Qualification = No RoHS compliant ELV compliant Lead Free Solder Processes = Wave solder capable to 240°C Lead Free Solder Processes = Wave solder capable to 260°C Lead Free Solder Processes = Wave solder capable to 265°C Lead Free Solder Processes = Reflow solder capable to 245°C Lead Free Solder Processes = Reflow solder capable to 260°C Lead Free Solder Processes = Pin-in-Paste capable to 245°C Lead Free Solder Processes = Pin-in-Paste capable to 260°C Mating Pin Dia. Range = .33 - .51 mm Socket Length = 3.61 mm Sleeve Style = Closed Bottom Tin Sleeve Plating Material Tin Contact Spring Plating Production Application Without Sealant Insertion Method = Hand/Semi-Automatic Packaging Method = Loose Piece Always was RoHS compliant Copper Sleeve Material Beryllium Copper Spring Material Recommended Hole Size = 1.04 mm
View Product Details for 2-5330808-7
	2-5331272-3 Active Add to Part List	Government/Industry Qualification = No RoHS compliant ELV compliant Lead Free Solder Processes = Wave solder capable to 240°C Lead Free Solder Processes = Wave solder capable to 260°C Lead Free Solder Processes = Wave solder capable to 265°C Lead Free Solder Processes = Reflow solder capable to 245°C Lead Free Solder Processes = Reflow solder capable to 260°C Lead Free Solder Processes = Pin-in-Paste capable to 245°C Lead Free Solder Processes = Pin-in-Paste capable to 260°C Mating Pin Dia. Range = .46 - .51 mm Socket Length = 3.51 mm Sleeve Style = Closed Bottom Tin Sleeve Plating Material Gold (30) Contact Spring Plating Production Application Without Sealant Insertion Method = Hand/Semi-Automatic Packaging Method = Loose Piece Always was RoHS compliant Copper Sleeve Material Beryllium Copper Spring Material Recommended Hole Size = 1.32 mm
View Product Details for 2-5331272-3
	2-5331272-5 Active Add to Part List	Government/Industry Qualification = No RoHS compliant ELV compliant Lead Free Solder Processes = Wave solder capable to 240°C Lead Free Solder Processes = Wave solder capable to 260°C Lead Free Solder Processes = Wave solder capable to 265°C Lead Free Solder Processes = Reflow solder capable to 245°C Lead Free Solder Processes = Reflow solder capable to 260°C Lead Free Solder Processes = Pin-in-Paste capable to 245°C Lead Free Solder Processes = Pin-in-Paste capable to 260°C Mating Pin Dia. Range = .56 - .64 mm Socket Length = 3.51 mm Sleeve Style = Closed Bottom Tin Sleeve Plating Material Tin Contact Spring Plating Production Application Without Sealant Insertion Method = Hand/Semi-Automatic Packaging Method = Loose Piece Always was RoHS compliant Copper Sleeve Material Beryllium Copper Spring Material Recommended Hole Size = 1.32 mm
View Product Details for 2-5331272-5
	2-5331272-7 Active Add to Part List	Government/Industry Qualification = No RoHS compliant ELV compliant Lead Free Solder Processes = Wave solder capable to 240°C Lead Free Solder Processes = Wave solder capable to 260°C Lead Free Solder Processes = Wave solder capable to 265°C Lead Free Solder Processes = Reflow solder capable to 245°C Lead Free Solder Processes = Reflow solder capable to 260°C Lead Free Solder Processes = Pin-in-Paste capable to 245°C Lead Free Solder Processes = Pin-in-Paste capable to 260°C Mating Pin Dia. Range = .56 - .64 mm Socket Length = 3.51 mm Sleeve Style = Closed Bottom Tin Sleeve Plating Material Gold (30) Contact Spring Plating Production Application Without Sealant Insertion Method = Hand/Semi-Automatic Packaging Method = Loose Piece Always was RoHS compliant Copper Sleeve Material Beryllium Copper Spring Material Recommended Hole Size = 1.32 mm
View Product Details for 2-5331272-7
	2-5331677-2 Active Add to Part List	Government/Industry Qualification = No RoHS compliant ELV compliant Lead Free Solder Processes = Wave solder capable to 240°C Lead Free Solder Processes = Wave solder capable to 260°C Lead Free Solder Processes = Wave solder capable to 265°C Lead Free Solder Processes = Reflow solder capable to 245°C Lead Free Solder Processes = Reflow solder capable to 260°C Lead Free Solder Processes = Pin-in-Paste capable to 245°C Lead Free Solder Processes = Pin-in-Paste capable to 260°C Mating Pin Dia. Range = .76 - .84 mm Socket Length = 3.51 mm Sleeve Style = Open Bottom Tin Sleeve Plating Material Gold (30) Contact Spring Plating Production Application Without Sealant Insertion Method = Hand/Semi-Automatic/Automatic Packaging Method = Loose Piece Always was RoHS compliant Copper Sleeve Material Beryllium Copper Spring Material Recommended Hole Size = 1.57 mm
View Product Details for 2-5331677-2
	2-5332070-3 Active Add to Part List	Government/Industry Qualification = No RoHS compliant ELV compliant Lead Free Solder Processes = Wave solder capable to 240°C Lead Free Solder Processes = Wave solder capable to 260°C Lead Free Solder Processes = Wave solder capable to 265°C Lead Free Solder Processes = Reflow solder capable to 245°C Lead Free Solder Processes = Reflow solder capable to 260°C Lead Free Solder Processes = Pin-in-Paste capable to 245°C Lead Free Solder Processes = Pin-in-Paste capable to 260°C Mating Pin Dia. Range = .94 - 1.02 mm Socket Length = 3.63 mm Sleeve Style = Closed Bottom Tin Sleeve Plating Material Gold (30) Contact Spring Plating Production Application Without Sealant Insertion Method = Hand/Semi-Automatic Packaging Method = Loose Piece Always was RoHS compliant Beryllium Copper Spring Material Recommended Hole Size = 1.83 mm
View Product Details for 2-5332070-3
	2-5332070-5 Active Add to Part List	Government/Industry Qualification = No RoHS compliant ELV compliant Lead Free Solder Processes = Wave solder capable to 240°C Lead Free Solder Processes = Wave solder capable to 260°C Lead Free Solder Processes = Wave solder capable to 265°C Lead Free Solder Processes = Reflow solder capable to 245°C Lead Free Solder Processes = Reflow solder capable to 260°C Lead Free Solder Processes = Pin-in-Paste capable to 245°C Lead Free Solder Processes = Pin-in-Paste capable to 260°C Mating Pin Dia. Range = .76 - .84 mm Socket Length = 3.63 mm Sleeve Style = Open Bottom Tin Sleeve Plating Material Gold (30) Contact Spring Plating Production Application Without Sealant Insertion Method = Hand/Semi-Automatic Packaging Method = Loose Piece Always was RoHS compliant Beryllium Copper Spring Material Recommended Hole Size = 1.83 mm
View Product Details for 2-5332070-5

This list is temporary. The list will not be viewable on another computer and will be deleted within 30 days.

If your browser cookies are cleared, your temporary list will be lost. You can save this list and get all of the My Part List features by becoming a registered user of the Tyco Electronics web site.

Products

Documentation

Resources

My Account

Customer Support

Product List for Discrete Sockets

Corporate Information

Quick Links

Customer Support