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Showing 1 - 20 of 365 Matching Products

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Part Differing Features
Click here for product details for 251895-000

  • TMS-SCE Series
  • Marker Sleeve
  • Military Grade
  • Radiation Cross-Linked Polyolefin Material
  • Shrink Ratio = 2:1
  • Operating Temperature = -55 - 135 °C
  • Expanded ID, Min. = 3.18 mm
  • Recovered ID, Max. = 1.57 mm
  • Recommended Wire OD Use Range = 1.75 - 2.66 mm
  • Wall Thickness - Full Recovery (Nominal) = .51 mm
Always EU RoHS/ELV Compliant, Not applicable for solder process capability
Click here for product details for TMS-SCE-1K-1/4-2.0-0

  • TMS-SCE Series
  • Marker Sleeve
  • Military Grade
  • Radiation Cross-Linked Polyolefin Material
  • Shrink Ratio = 3:1
  • Operating Temperature = -55 - 135 °C
  • Expanded ID, Min. = 6.35 mm
  • Recovered ID, Max. = 2.11 mm
  • Recommended Wire OD Use Range = 2.31 - 5.46 mm
  • Wall Thickness - Full Recovery (Nominal) = .58 mm
Always EU RoHS/ELV Compliant, Not applicable for solder process capability
Click here for product details for TMS-SCE-1K-1/4-2.0-6

  • TMS-SCE Series
  • Marker Sleeve
  • Military Grade
  • Radiation Cross-Linked Polyolefin Material
  • Shrink Ratio = 3:1
  • Operating Temperature = -55 - 135 °C
  • Expanded ID, Min. = 6.35 mm
  • Recovered ID, Max. = 2.11 mm
  • Recommended Wire OD Use Range = 2.31 - 5.46 mm
  • Wall Thickness - Full Recovery (Nominal) = .58 mm
Always EU RoHS/ELV Compliant, Not applicable for solder process capability
Click here for product details for TMS-SCE-1K-1/4-2.0-9

  • TMS-SCE Series
  • Marker Sleeve
  • Military Grade
  • Radiation Cross-Linked Polyolefin Material
  • Shrink Ratio = 3:1
  • Operating Temperature = -55 - 135 °C
  • Expanded ID, Min. = 6.35 mm
  • Recovered ID, Max. = 2.11 mm
  • Recommended Wire OD Use Range = 2.31 - 5.46 mm
  • Wall Thickness - Full Recovery (Nominal) = .58 mm
Always EU RoHS/ELV Compliant, Not applicable for solder process capability
Click here for product details for TMS-SCE-1K-1/8-2.0-0

  • TMS-SCE Series
  • Marker Sleeve
  • Military Grade
  • Radiation Cross-Linked Polyolefin Material
  • Shrink Ratio = 3:1
  • Operating Temperature = -55 - 135 °C
  • Expanded ID, Min. = 3.18 mm
  • Recovered ID, Max. = 1.07 mm
  • Recommended Wire OD Use Range = 1.11 - 2.66 mm
  • Wall Thickness - Full Recovery (Nominal) = .58 mm
Always EU RoHS/ELV Compliant, Not applicable for solder process capability
Click here for product details for TMS-SCE-1K-1/8-2.0-3

  • TMS-SCE Series
  • Marker Sleeve
  • Military Grade
  • Radiation Cross-Linked Polyolefin Material
  • Shrink Ratio = 3:1
  • Operating Temperature = -55 - 135 °C
  • Expanded ID, Min. = 3.18 mm
  • Recovered ID, Max. = 1.07 mm
  • Recommended Wire OD Use Range = 1.11 - 2.66 mm
  • Wall Thickness - Full Recovery (Nominal) = .58 mm
Always EU RoHS/ELV Compliant, Not applicable for solder process capability
Click here for product details for TMS-SCE-1K-1/8-2.0-4

  • TMS-SCE Series
  • Marker Sleeve
  • Military Grade
  • Radiation Cross-Linked Polyolefin Material
  • Shrink Ratio = 3:1
  • Operating Temperature = -55 - 135 °C
  • Expanded ID, Min. = 3.18 mm
  • Recovered ID, Max. = 1.07 mm
  • Recommended Wire OD Use Range = 1.11 - 2.66 mm
  • Wall Thickness - Full Recovery (Nominal) = .58 mm
Always EU RoHS/ELV Compliant, Not applicable for solder process capability
Click here for product details for TMS-SCE-1K-1/8-2.0-5

  • TMS-SCE Series
  • Marker Sleeve
  • Military Grade
  • Radiation Cross-Linked Polyolefin Material
  • Shrink Ratio = 3:1
  • Operating Temperature = -55 - 135 °C
  • Expanded ID, Min. = 3.18 mm
  • Recovered ID, Max. = 1.07 mm
  • Recommended Wire OD Use Range = 1.11 - 2.66 mm
  • Wall Thickness - Full Recovery (Nominal) = .58 mm
Always EU RoHS/ELV Compliant, Not applicable for solder process capability
Click here for product details for TMS-SCE-1K-1/8-2.0-9

  • TMS-SCE Series
  • Marker Sleeve
  • Military Grade
  • Radiation Cross-Linked Polyolefin Material
  • Shrink Ratio = 3:1
  • Operating Temperature = -55 - 135 °C
  • Expanded ID, Min. = 3.18 mm
  • Recovered ID, Max. = 1.07 mm
  • Recommended Wire OD Use Range = 1.11 - 2.66 mm
  • Wall Thickness - Full Recovery (Nominal) = .58 mm
Always EU RoHS/ELV Compliant, Not applicable for solder process capability
Click here for product details for TMS-SCE-1K-3/16-2.0-0

  • TMS-SCE Series
  • Marker Sleeve
  • Military Grade
  • Radiation Cross-Linked Polyolefin Material
  • Shrink Ratio = 3:1
  • Operating Temperature = -55 - 135 °C
  • Expanded ID, Min. = 4.75 mm
  • Recovered ID, Max. = 1.57 mm
  • Recommended Wire OD Use Range = 1.75 - 2.66 mm
  • Wall Thickness - Full Recovery (Nominal) = .58 mm
Always EU RoHS/ELV Compliant, Not applicable for solder process capability
Click here for product details for TMS-SCE-1K-3/16-2.0-4

  • TMS-SCE Series
  • Marker Sleeve
  • Military Grade
  • Radiation Cross-Linked Polyolefin Material
  • Shrink Ratio = 3:1
  • Operating Temperature = -55 - 135 °C
  • Expanded ID, Min. = 4.75 mm
  • Recovered ID, Max. = 1.57 mm
  • Recommended Wire OD Use Range = 1.75 - 2.66 mm
  • Wall Thickness - Full Recovery (Nominal) = .58 mm
Always EU RoHS/ELV Compliant, Not applicable for solder process capability
Click here for product details for TMS-SCE-1K-3/16-2.0-9

  • TMS-SCE Series
  • Marker Sleeve
  • Military Grade
  • Radiation Cross-Linked Polyolefin Material
  • Shrink Ratio = 3:1
  • Operating Temperature = -55 - 135 °C
  • Expanded ID, Min. = 4.75 mm
  • Recovered ID, Max. = 1.57 mm
  • Recommended Wire OD Use Range = 1.75 - 2.66 mm
  • Wall Thickness - Full Recovery (Nominal) = .58 mm
Always EU RoHS/ELV Compliant, Not applicable for solder process capability
Click here for product details for TMS-SCE-1K-3/32-2.0-4

  • TMS-SCE Series
  • Marker Sleeve
  • Military Grade
  • Radiation Cross-Linked Polyolefin Material
  • Shrink Ratio = 3:1
  • Operating Temperature = -55 - 135 °C
  • Expanded ID, Min. = 2.36 mm
  • Recovered ID, Max. = .80 mm
  • Recommended Wire OD Use Range = .81 - 1.9 mm
  • Wall Thickness - Full Recovery (Nominal) = .53 mm
Always EU RoHS/ELV Compliant, Not applicable for solder process capability
Click here for product details for TMS-SCE-1K-3/32-2.0-9

  • TMS-SCE Series
  • Marker Sleeve
  • Military Grade
  • Radiation Cross-Linked Polyolefin Material
  • Shrink Ratio = 3:1
  • Operating Temperature = -55 - 135 °C
  • Expanded ID, Min. = 2.36 mm
  • Recovered ID, Max. = .80 mm
  • Recommended Wire OD Use Range = .81 - 1.9 mm
  • Wall Thickness - Full Recovery (Nominal) = .53 mm
Always EU RoHS/ELV Compliant, Not applicable for solder process capability
Click here for product details for TMS-SCE-1K-3/8-2.0-0

  • TMS-SCE Series
  • Marker Sleeve
  • Military Grade
  • Radiation Cross-Linked Polyolefin Material
  • Shrink Ratio = 3:1
  • Operating Temperature = -55 - 135 °C
  • Expanded ID, Min. = 9.53 mm
  • Recovered ID, Max. = 3.18 mm
  • Recommended Wire OD Use Range = 3.47 - 8.12 mm
  • Wall Thickness - Full Recovery (Nominal) = .61 mm
Always EU RoHS/ELV Compliant, Not applicable for solder process capability
Click here for product details for TMS-SCE-1K-3/8-2.0-4

  • TMS-SCE Series
  • Marker Sleeve
  • Military Grade
  • Radiation Cross-Linked Polyolefin Material
  • Shrink Ratio = 3:1
  • Operating Temperature = -55 - 135 °C
  • Expanded ID, Min. = 9.53 mm
  • Recovered ID, Max. = 3.18 mm
  • Recommended Wire OD Use Range = 3.47 - 8.12 mm
  • Wall Thickness - Full Recovery (Nominal) = .61 mm
Always EU RoHS/ELV Compliant, Not applicable for solder process capability
Click here for product details for TMS-SCE-1K-3/8-2.0-9

  • TMS-SCE Series
  • Marker Sleeve
  • Military Grade
  • Radiation Cross-Linked Polyolefin Material
  • Shrink Ratio = 3:1
  • Operating Temperature = -55 - 135 °C
  • Expanded ID, Min. = 9.53 mm
  • Recovered ID, Max. = 3.18 mm
  • Recommended Wire OD Use Range = 3.47 - 8.12 mm
  • Wall Thickness - Full Recovery (Nominal) = .61 mm
Always EU RoHS/ELV Compliant, Not applicable for solder process capability
Click here for product details for TMS-SCE-2X-1K-1/4-9

  • TMS-SCE Series
  • Marker Sleeve
  • Military Grade
  • Radiation Cross-Linked Polyolefin Material
  • Shrink Ratio = 2:1
  • Operating Temperature = -55 - 135 °C
  • Expanded ID, Min. = 6.35 mm
  • Recovered ID, Max. = 3.18 mm
  • Recommended Wire OD Use Range = 3.81 - 5.46 mm
  • Wall Thickness - Full Recovery (Nominal) = .64 mm
Always EU RoHS/ELV Compliant, Not applicable for solder process capability
Click here for product details for TMS-SCE-2X-1K-3/16-9

  • TMS-SCE Series
  • Marker Sleeve
  • Military Grade
  • Radiation Cross-Linked Polyolefin Material
  • Shrink Ratio = 2:1
  • Operating Temperature = -55 - 135 °C
  • Expanded ID, Min. = 4.75 mm
  • Recovered ID, Max. = 2.36 mm
  • Recommended Wire OD Use Range = 2.54 - 4.06 mm
  • Wall Thickness - Full Recovery (Nominal) = .51 mm
Always EU RoHS/ELV Compliant, Not applicable for solder process capability
Click here for product details for TMS-SCE-2X-1K-3/8-2.0-9

  • TMS-SCE Series
  • Marker Sleeve
  • Military Grade
  • Radiation Cross-Linked Polyolefin Material
  • Shrink Ratio = 2:1
  • Operating Temperature = -55 - 135 °C
  • Expanded ID, Min. = 9.53 mm
  • Recovered ID, Max. = 4.75 mm
  • Recommended Wire OD Use Range = 5.59 - 8.12 mm
  • Wall Thickness - Full Recovery (Nominal) = .64 mm
Always EU RoHS/ELV Compliant, Not applicable for solder process capability
Showing 1 - 20 of 365 Matching Products

Product Line Information

Previous Previous [1] 2 3 4 5 ... 19 Next Next
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