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Heat Sink Assemblies Overview


Thermal Solutions
Tyco Electronics Thermal Solutions offers a complete line of heat sinks Find in Catalogdesigned for attachment to BGA devices. Our patented Chip Cooler design is for lower wattage applications and incorporates a removable snap clip integrating a threaded radial or pin fin heat sink. The Chip Cooler product is fully re-enterable and includes the thermal interface material.

Tyco Electronics also offers heat sinks for XFP and SFP Pluggable Transceivers for networking, SAN and PCI applications. These are available in 3 industry standards:

  • SFP – Small Form Factor Platform
  • XFP – X Form Factor Platform
  • QSFP – Quad Small Factor Platform

Products

  • BGA Heat Sinks
  • DIMM Spreader Plates
  • SFP/XFP Heat sinks

Markets & Applications

  • Communications Equipment
  • Consumer Electronics
  • PC’s
  • Servers
  • Workstations
  • Business Equipment
  • Optical Transceivers
heat sinks
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