| Part |
Differing Features |

|
- TMS-SCE Series
- Military Grade
- Radiation Cross-Linked Polyolefin Material
- Shrink Ratio = 2:1
- Operating Temperature = -55 - 135 °C
|
- Expanded ID, Min. = 3.18 mm
- Recovered ID, Max. = 1.57 mm
- Recommended Wire OD Use Range = 1.75 - 2.66 mm
- Wall Thickness - Full Recovery (Nominal) = .51 mm
- Color = White
|
| Always EU RoHS/ELV Compliant, Not applicable for solder process capability |
|
|
|

|
- TMS-SCE Series
- Military Grade
- Radiation Cross-Linked Polyolefin Material
- Shrink Ratio = 3:1
- Operating Temperature = -55 - 135 °C
|
- Expanded ID, Min. = 6.35 mm
- Recovered ID, Max. = 2.11 mm
- Sleeve Length, Nominal = 50.8 mm
- Recommended Wire OD Use Range = 2.31 - 5.46 mm
- Wall Thickness - Full Recovery (Nominal) = .58 mm
|
| Always EU RoHS/ELV Compliant, Not applicable for solder process capability |
|
|
|

|
- TMS-SCE Series
- Military Grade
- Radiation Cross-Linked Polyolefin Material
- Shrink Ratio = 3:1
- Operating Temperature = -55 - 135 °C
|
- Expanded ID, Min. = 6.35 mm
- Recovered ID, Max. = 2.11 mm
- Sleeve Length, Nominal = 50.8 mm
- Recommended Wire OD Use Range = 2.31 - 5.46 mm
- Wall Thickness - Full Recovery (Nominal) = .58 mm
|
| Always EU RoHS/ELV Compliant, Not applicable for solder process capability |
|
|
|

|
- TMS-SCE Series
- Military Grade
- Radiation Cross-Linked Polyolefin Material
- Shrink Ratio = 3:1
- Operating Temperature = -55 - 135 °C
|
- Expanded ID, Min. = 6.35 mm
- Recovered ID, Max. = 2.11 mm
- Sleeve Length, Nominal = 50.8 mm
- Recommended Wire OD Use Range = 2.31 - 5.46 mm
- Wall Thickness - Full Recovery (Nominal) = .58 mm
|
| Always EU RoHS/ELV Compliant, Not applicable for solder process capability |
|
|
|

|
- TMS-SCE Series
- Military Grade
- Radiation Cross-Linked Polyolefin Material
- Shrink Ratio = 3:1
- Operating Temperature = -55 - 135 °C
|
- Expanded ID, Min. = 3.18 mm
- Recovered ID, Max. = 1.07 mm
- Sleeve Length, Nominal = 50.8 mm
- Recommended Wire OD Use Range = 1.11 - 2.66 mm
- Wall Thickness - Full Recovery (Nominal) = .58 mm
|
| Always EU RoHS/ELV Compliant, Not applicable for solder process capability |
|
|
|

|
- TMS-SCE Series
- Military Grade
- Radiation Cross-Linked Polyolefin Material
- Shrink Ratio = 3:1
- Operating Temperature = -55 - 135 °C
|
- Expanded ID, Min. = 3.18 mm
- Recovered ID, Max. = 1.07 mm
- Sleeve Length, Nominal = 50.8 mm
- Recommended Wire OD Use Range = 1.11 - 2.66 mm
- Wall Thickness - Full Recovery (Nominal) = .58 mm
|
| Always EU RoHS/ELV Compliant, Not applicable for solder process capability |
|
|
|

|
- TMS-SCE Series
- Military Grade
- Radiation Cross-Linked Polyolefin Material
- Shrink Ratio = 3:1
- Operating Temperature = -55 - 135 °C
|
- Expanded ID, Min. = 3.18 mm
- Recovered ID, Max. = 1.07 mm
- Sleeve Length, Nominal = 50.8 mm
- Recommended Wire OD Use Range = 1.11 - 2.66 mm
- Wall Thickness - Full Recovery (Nominal) = .58 mm
|
| Always EU RoHS/ELV Compliant, Not applicable for solder process capability |
|
|
|

|
- TMS-SCE Series
- Military Grade
- Radiation Cross-Linked Polyolefin Material
- Shrink Ratio = 3:1
- Operating Temperature = -55 - 135 °C
|
- Expanded ID, Min. = 3.18 mm
- Recovered ID, Max. = 1.07 mm
- Sleeve Length, Nominal = 50.8 mm
- Recommended Wire OD Use Range = 1.11 - 2.66 mm
- Wall Thickness - Full Recovery (Nominal) = .58 mm
|
| Always EU RoHS/ELV Compliant, Not applicable for solder process capability |
|
|
|

|
- TMS-SCE Series
- Military Grade
- Radiation Cross-Linked Polyolefin Material
- Shrink Ratio = 3:1
- Operating Temperature = -55 - 135 °C
|
- Expanded ID, Min. = 3.18 mm
- Recovered ID, Max. = 1.07 mm
- Sleeve Length, Nominal = 50.8 mm
- Recommended Wire OD Use Range = 1.11 - 2.66 mm
- Wall Thickness - Full Recovery (Nominal) = .58 mm
|
| Always EU RoHS/ELV Compliant, Not applicable for solder process capability |
|
|
|

|
- TMS-SCE Series
- Military Grade
- Radiation Cross-Linked Polyolefin Material
- Shrink Ratio = 3:1
- Operating Temperature = -55 - 135 °C
|
- Expanded ID, Min. = 4.75 mm
- Recovered ID, Max. = 1.57 mm
- Sleeve Length, Nominal = 50.8 mm
- Recommended Wire OD Use Range = 1.75 - 2.66 mm
- Wall Thickness - Full Recovery (Nominal) = .58 mm
|
| Always EU RoHS/ELV Compliant, Not applicable for solder process capability |
|
|
|

|
- TMS-SCE Series
- Military Grade
- Radiation Cross-Linked Polyolefin Material
- Shrink Ratio = 3:1
- Operating Temperature = -55 - 135 °C
|
- Expanded ID, Min. = 4.75 mm
- Recovered ID, Max. = 1.57 mm
- Sleeve Length, Nominal = 50.8 mm
- Recommended Wire OD Use Range = 1.75 - 2.66 mm
- Wall Thickness - Full Recovery (Nominal) = .58 mm
|
| Always EU RoHS/ELV Compliant, Not applicable for solder process capability |
|
|
|

|
- TMS-SCE Series
- Military Grade
- Radiation Cross-Linked Polyolefin Material
- Shrink Ratio = 3:1
- Operating Temperature = -55 - 135 °C
|
- Expanded ID, Min. = 4.75 mm
- Recovered ID, Max. = 1.57 mm
- Sleeve Length, Nominal = 50.8 mm
- Recommended Wire OD Use Range = 1.75 - 2.66 mm
- Wall Thickness - Full Recovery (Nominal) = .58 mm
|
| Always EU RoHS/ELV Compliant, Not applicable for solder process capability |
|
|
|

|
- TMS-SCE Series
- Military Grade
- Radiation Cross-Linked Polyolefin Material
- Shrink Ratio = 3:1
- Operating Temperature = -55 - 135 °C
|
- Expanded ID, Min. = 2.36 mm
- Recovered ID, Max. = .80 mm
- Sleeve Length, Nominal = 50.8 mm
- Recommended Wire OD Use Range = .81 - 1.9 mm
- Wall Thickness - Full Recovery (Nominal) = .53 mm
|
| Always EU RoHS/ELV Compliant, Not applicable for solder process capability |
|
|
|

|
- TMS-SCE Series
- Military Grade
- Radiation Cross-Linked Polyolefin Material
- Shrink Ratio = 3:1
- Operating Temperature = -55 - 135 °C
|
- Expanded ID, Min. = 2.36 mm
- Recovered ID, Max. = .80 mm
- Sleeve Length, Nominal = 50.8 mm
- Recommended Wire OD Use Range = .81 - 1.9 mm
- Wall Thickness - Full Recovery (Nominal) = .53 mm
|
| Always EU RoHS/ELV Compliant, Not applicable for solder process capability |
|
|
|

|
- TMS-SCE Series
- Military Grade
- Radiation Cross-Linked Polyolefin Material
- Shrink Ratio = 3:1
- Operating Temperature = -55 - 135 °C
|
- Expanded ID, Min. = 9.53 mm
- Recovered ID, Max. = 3.18 mm
- Recommended Wire OD Use Range = 3.47 - 8.12 mm
- Wall Thickness - Full Recovery (Nominal) = .61 mm
- Color = Black
|
| Always EU RoHS/ELV Compliant, Not applicable for solder process capability |
|
|
|

|
- TMS-SCE Series
- Military Grade
- Radiation Cross-Linked Polyolefin Material
- Shrink Ratio = 3:1
- Operating Temperature = -55 - 135 °C
|
- Expanded ID, Min. = 9.53 mm
- Recovered ID, Max. = 3.18 mm
- Sleeve Length, Nominal = 50.8 mm
- Recommended Wire OD Use Range = 3.47 - 8.12 mm
- Wall Thickness - Full Recovery (Nominal) = .61 mm
|
| Always EU RoHS/ELV Compliant, Not applicable for solder process capability |
|
|
|

|
- TMS-SCE Series
- Military Grade
- Radiation Cross-Linked Polyolefin Material
- Shrink Ratio = 3:1
- Operating Temperature = -55 - 135 °C
|
- Expanded ID, Min. = 9.53 mm
- Recovered ID, Max. = 3.18 mm
- Sleeve Length, Nominal = 50.8 mm
- Recommended Wire OD Use Range = 3.47 - 8.12 mm
- Wall Thickness - Full Recovery (Nominal) = .61 mm
|
| Always EU RoHS/ELV Compliant, Not applicable for solder process capability |
|
|
|

|
- TMS-SCE Series
- Military Grade
- Radiation Cross-Linked Polyolefin Material
- Shrink Ratio = 2:1
- Operating Temperature = -55 - 135 °C
|
- Expanded ID, Min. = 6.35 mm
- Recovered ID, Max. = 3.18 mm
- Recommended Wire OD Use Range = 3.81 - 5.46 mm
- Wall Thickness - Full Recovery (Nominal) = .64 mm
- Color = White
|
| Always EU RoHS/ELV Compliant, Not applicable for solder process capability |
|
|
|

|
- TMS-SCE Series
- Military Grade
- Radiation Cross-Linked Polyolefin Material
- Shrink Ratio = 2:1
- Operating Temperature = -55 - 135 °C
|
- Expanded ID, Min. = 4.75 mm
- Recovered ID, Max. = 2.36 mm
- Recommended Wire OD Use Range = 2.54 - 4.06 mm
- Wall Thickness - Full Recovery (Nominal) = .51 mm
- Color = White
|
| Always EU RoHS/ELV Compliant, Not applicable for solder process capability |
|
|
|

|
- TMS-SCE Series
- Military Grade
- Radiation Cross-Linked Polyolefin Material
- Shrink Ratio = 2:1
- Operating Temperature = -55 - 135 °C
|
- Expanded ID, Min. = 9.53 mm
- Recovered ID, Max. = 4.75 mm
- Recommended Wire OD Use Range = 5.59 - 8.12 mm
- Wall Thickness - Full Recovery (Nominal) = .64 mm
- Color = White
|
| Always EU RoHS/ELV Compliant, Not applicable for solder process capability |
|
|
|