| Manufacturing Capabilities Tyco Electronics is an experienced antenna manufacturer offering several technologies that deliver optimal and well-proven solutions for diverse applications. Our sales, engineering and operation departments work seamlessly together to accommodate the needs of our customers with creative designs, innovative solutions, unsurpassed manufacturing capabilities and competitive pricing.
Tyco Electronics most commonly utilizes the following manufacturing technologies: Molded Interconnect Device (MID) 2-Shot and LDS Technology, Stamped Metal, Printed Circuit Board (PCB) and Flexible Printed Circuit (FPC).
MID Technology
Tyco Electronics is one of the leading provider of Molded Interconnect Device (MID) technology with multiple years mass production experience. In its most basic form, MID technology is defined as a process that results in selectively plated plastic parts. This technology is most often used in three basic ways: electro-mechanical (signal or current carrying traces), RF technology (antennas), and for shielding applications. MIDs can integrate electrical and mechanical elements into almost any shape of interconnect device allowing entirely new functions to be created.
Tyco Electronics utilizes two different technologies to manufacture MID antennas: 2-Shot molding and Laser Direct Structuring (LDS).
 
Two Shot MID Technology
Two Shot molding is a mature and well understood process that remains viable for cost effective and repeatable production of MIDs. The basic process has only two steps, injection molding of two distinct thermoplastic polymers and the electroless plating process, resulting in a selectively plated component. In order to achieve the selectivity during plating, a catalyst doped "plateable" resin is molded in conjunction with a standard non-plateable resin to define the desired area to be plated. This area is metallized initially with copper, followed by nickel and, optionally, gold plating. The following are just a few of the several advantages that MID 2-Shot technology delivers compared to alternative technologies:
- Design flexibility for complex 3D geometries
- Ability to integrate multiple functions into one component
- Tightest tolerance for pattern registration to carrier
- Fewest manufacturing steps and processes
Laser Direct Structuring MID Technology
Laser Direct Structuring (LDS) is a new and exciting technology used to create Molded Interconnect Devices (MID). Through the use of the dedicated laser system and a variety of resins, it opens up many possibilities to create 3 dimensional MIDs with finer line width and spacing than what is possible with the conventional MID processes. The LDS is a three step process. First, the antenna is molded in a standard single shot mold using one of the LDS resins. Second, the desired pattern is directly structured onto the antenna by the 3D laser system. Finally, the pattern is plated using the industry-standard methods where the plating adheres only where the plastic that has been activated by the laser, thus creating a conductive pattern. LDS offers the same advantages as the 2-Shot technology mentioned above plus additional:
- Ability to produce thin (0.15 mm) traces
- Flexibility for pattern changes during production
- Simple/fastest/lowest cost tooling
Stamped Metal Antennas
Stamped Metal antennas offer OEM's a low cost and highly repeatable manufacturing solution. Stampings are a proven solution with several advantages such as:
- Lowest cost
- Integrated contacts (eliminates pogo pins)
- High volume capable production die
- Additional assembly stations may be added for volume upswings
Flexible Printed Circuit (FPC) and Printed Circuit Board (PCB) Antennas
Flexible Printed Circuits and Printed Circuit Boards are ideal for multi band antennas, allowing virtually any wireless product to operate at different frequencies without multiple antennas. Tyco Electronics offers a range of low profile, high performance PCB embedded antennas. Similar to our Stamped Metal antennas, FPC and PCB antennas offer OEM's a low cost and highly repeatable manufacturing solutions in a number of standard "off the shelf" or customized antenna designs. FPC and PCB antennas address the needs of a variety of wireless applications and offer several advantages such as:
- Low cost tooling investment
- Flexibility for pattern changes during production
- Shortest lead time for tool build
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