HXC125 Polymer Interconnect System Overview

Tyco Electronics is pleased to announce our second generation of polymer interconnect – HXC125. This highly crosslinked contact is comprised of a specific silver powder encapsulated in a customized polymer blend. This unique combination of materials creates a strong molecular bond which allows for highly improved contact performance.

• Revolutionary material withstands operating temperatures up to 125°C
• Socket durability exceeds 40 mating cycles
• Superior electrical performance
• Available in 0.5 mm, 0.80 mm, 1.00 mm and 1.27 mm pitch
• Applications include LGA sockets, BGA sockets, Board-to-Board and Flex-to-Board connectors
• Easily customized for your application