| Increasing system performance is a continuous challenge within the interconnection channel. One design approach gaining momentum in the industry is the reduction of the system characteristic impedance from 100 ohm to 85 ohm. Such a reduction of impedance from 100 ohm to 85 ohm can improve overall system performance by incorporating thinner PC boards, increasing density with same board thickness and making it easier to match the system impedance to the connector footprint impedance.
Tyco Electronics is leading the way in providing a complete interconnect solution for this emerging market. The new suite of Z-PACK TinMan 85 ohm connectors  provides the same industry leading performance and features and benefits designed into the standard 100 ohm Z-PACK TinMan connector system but in an 85 ohm impedance package. This connector was designed to provide 85 ohm nominal characteristic impedance through the entire connector, from PCB footprint to PCB footprint. Tyco Electronics and ©Intel Corporation are in evaluation phase of 85 Ohm Z-PACK TinMan connector for Intel® QuickPath Interconnect (QPI) connector development.
As part of the complete Z-PACK TinMan connector product family, the 85 ohm version offers fully protected right-angle and vertical receptacles for use on daughtercards and mezzanine boards where handling damage can be a concern when plugging to a mating header.
Ground contacts strategically positioned within each column of the connector, combined with unique contact lead frame arrangements, enable the Z-PACK TinMan 85 ohm connector to achieve low crosstalk and high through-put performance levels. A dual point of contact mating interface and compliant pin interface to printed circuit board help assure reliability.
Key Features
- 10+ Gb/s performance
- 85 ohm characteristic impedance for differential pair configuration
- 5 pair module offers 26 pairs/10mm [66 diff. pairs/inch] fitting within a 25.40 [1.00] card slot pitch
- 3 pair module offers 16 pairs/10mm [40 diff. pairs/inch] fitting within a 16.25 [.640] card slot pitch
- Configurations will be available in right angle and vertical pin headers and right angle and vertical receptacles
- Reliable, redundant contact design on every signal contact
- Modular system offered in various column modules
- Meets Industry reliability requirements of Telcordia
- Sequencing for ground and signal contacts
- RoHS Compliant
Applications
- Servers (Blade & Rack Mount)
- The Z-PACK TinMan 85 Ohm connector family is designed for the cost pressured, high performance, high signal density, Blade and Rack Mount Server applications implementing an 85 Ohm system impedance.
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Product Family Overview
