Dry Pack for Lead Free SMD Relays

Major impact caused by lead free soldering to the components is a higher peak soldering temperature and a longer process duration. Contrary to most other components relays are sealed components enclosing a certain amount of gas. The sealing of the relays is a major characteristics and must be maintained even during and after the soldering process. Due to the high temperature during the soldering process a pressure increase inside the relay happens. In case the plastic material adopted humidity during the storage, this humidity is evaporated during soldering, further significantly increasing the internal pressure of the relay housing. As this effect cannot be controlled, AXICOM has taken the decision to dry pack all relays suitable for SMD soldering processes. The additional cost will payback quickly by a smooth transition to lead free products.

Moisture Sensitive Level MSL: The moisture sensitive level defines the time, components can be stored outside the dry pack bag. All AXICOM SMD relays were tested and MSL 3 was assigned. MSL 3 means, that the relays can be unpacked for 168 hours, before processing.

Relays packed and protected by dry pack. The bag is evacuated and refilled with nitrogen, which results in a guaranteed shelf life between 3 and 5 years.