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White Papers

RoHS Technical Data
Electronic Interconnection Technology Wedge-Connector Technology in Power Utility Applications Contact Problems Due to Fretting and Their Solutions Avoiding Fretting Corrosion by Design Simulation of the Crimping Process by Implicit and Explicit Finite Element Methods Finite Element Analysis of Compression of Thin, High Modulus Cylindrical Shells with Low Modulus Core Analyzing Crosstalk and Ground Bounce in Multiconductor Systems Using SPICE Circuit Simulations New Algorithms for Calculating Hertzian Stresses, Deformations, and Contact Zone Parameters Shape Optimization of Connector Contacts for Reduced Wear and Reduced Insertion Force Calculation of Frequency-Dependent Impedance for Conductors of Rectangular Cross Section Metallic Electromigration Phenomena Fretting Corrosion in Electric Contacts Brief Overview of Reliability in General and for Electrical Connectors in Particular CSR Technology: Flexible Options for Fiber Optics Specifying Current for the Real World	Metrology Golden Rules: Guidelines for The Use of Gold on Connector Contacts The Tin Commandments: Guidelines for The Use of Tin on Connector Contacts A Practical and Reliable Method for Detection of Nanosecond Intermittency Correlation Between Measured and Simulated Parameters of a Proposed Transfer Standard Estimating and Measuring Thickness of Thin Layers by Monte Carlo Simulation and Backscattered Electron Image Analysis Testing for Radiated Emission by Electronic Devices Low-Level Contact Resistance Characterization Estimation of Uncertainty in Plate Thickness Measurement by X-ray Flourescence Spectrometry Keeping Tin Solderable "Solder Volumes for Through-Hole Reflow-Compatible Connectors" Hot Air Leveled Tin: Solderability and Some Related Properties Mateability of Tin to Gold, Palladium and Silver
Materials Technology Tyco Electronics HM-15 Lubricant Stability - Projected Weight Loss Uniaxial True Stress - True Strain After Necking Desorption of Hydrogen from Palladium Plating Cu-Sn Intermetallic Compound Growth in Hot-Air-Leveled Tin at and below 100 degrees C. Evaluation of Electroplated Nickel Phosphorous with High Phosphorous Content Magnetic Properties and Structure of Cobalt-Hardened Gold Connector Design/Materials and Connector Reliability	Technology Overview Stereolithography and Simultaneous Engineering Speed Products To Market Wireless Technologies and the Emerging WiMax Standard Addressing Interconnect Design Challenges in Power Over Ethernet Advances in High Density Optical Interconnects Circuit Protection Devices High Voltage Relays Non-Contact Sensors Technology Overview Power Systems ATCA Compliant Power Input Module

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