Laser Direct Structuring

The Laser Direct Structuring (LDS) is a new and exciting technology used to create molded interconnect devices (MID). Through the use of a dedicated laser system and a variety of proprietary resins, it opens up many exciting possibilities to create 3 dimensional MIDs with finer line width and spacing than what is possible with the conventional MID processes. The LDS is a 3 step process:

1. The part is molded in a standard single shot mold using one of the LDS resins.
2. The desired pattern is directly structured onto the part by the 3D laser system.
3. The pattern is then plated using the industry-standard methods where the plating adheres only where the plastic that has been activated by the laser, thus creating a conductive pattern.

Laser Direct Structuring is ideal for creating quick-turn prototypes as well as producing large quantities in the production environment. With LDS, the pattern changes no longer require extensive tooling modifications as in conventional MID and can be quickly implemented as a running change. The fine-pitch structuring and the overall precision of the LDS technology find use in a large array of applications across many industries.