History

MID technology is approaching 30 years of existence. In the early 1980's 3D molded interconnect devices were considered a breakthrough in electronics because of the potential to integrate electrical and mechanical functionality into a single component. At this time early 3D feasibility samples were co-produced by AT&T Bell Labs, Union Carbide, and General Electric. Shortly after in 1983 the first "Molded Circuit Boards" were developed by Circuit-Wise and General Electric joint venture Mint-Pac technologies. However, 3D MIDs failed to meet the far-reaching expectations of eliminating conventional circuit boards by putting conductive paths directly onto the surface of molded plastic devices.

MIDs gained broader acceptance as a new process, 2-Shot molding, was developed in 1986 by Eastman Kodak / Mitsui Petrochemical / Pathtek. Ten years later, the leaders of MID technology merged to form Molded Interconnect Device, LLC (MID) and successfully applied 2-Shot technology in high-volume MID applications. MID, LLC developed unique technical capabilities, a strong customer base, well trained technical staff, and a leading edge capital equipment base.

In 2001, Tyco Electronics acquired MID, LLC. MID is headquartered in Rochester, NY and prides itself in being the world's leader in utilizing its technology to improve everyday products.

In order to bridge the gaps between cost, flexibility and part complexity, Tyco Electronics acquired Laser Direct Structuring (LDS) technology in 2005. LDS technology introduced a simpler and more environmentally friendly MID process.

In 2007, Tyco Electronics added a state-of-the-art MID automated plating line and in Qingdao, China, replicating the original processes and designs of the Rochester, NY facility. The Qingdao plant combines tooling, molding, and plating capabilities all under one roof.

Today, Tyco Electronics continues to combine world class MID design competency with unsurpassed integration and optimization skills to provide the best solutions for various applications.