MID Technology

Tyco Electronics prides itself in being the global leader in providing Molded Interconnect Device (MID) Technology. In its most basic form, MID technology can be defined as a process that results in selectively plated plastic parts. This technology is most often used in the three basic ways: electromechanical (signal or current carrying traces), RF technology (antennas), and for shielding applications. MIDs can integrate electrical and mechanical elements into almost any shape of interconnect device; allowing entirely new functions to be created while facilitating the miniaturization of products.

Tyco Electronics can manufacture MID parts using three manufacturing technologies: 2-Shot Molding, Laser Direct Structuring, and Laser Imaging.